High-performance industrial tablet computer, including ventilation hole, charging port, tablet body, performance screen, cushion, rubber column, port, moisture removal fan, fever wire, humidity tester, temperature control switch, filter, heat sink, tablet computer. The main board and the heat dissipation hole, the middle end of the top of the heat sink is equipped with a dehumidification electric fan screw, the inside of the dehumidification electric fan is equipped with a fever wire and the two are connected, and the top of the dehumidification electric fan is arranged with a humidity tester screw. continued. This is suitable for a series of dehumidification fans, such as a series of dehumidification flat computer motherboards. A dehumidification fan is installed on the heat sink of the motherboard of a dehumidification tablet computer. The fan is equipped with a fever wire winding. The humidity tester is used to monitor the main board. The fever wire blows the heated hot air into the motherboard through the filter to reach the goal of dehumidification, ensuring that the components on the tablet computer motherboard are dried up, and there is also a rubber column and cushion to achieve the simulation result.
A general protection type industrial tablet computer. The computer includes a main cabinet, a heat dissipation back cover, a touch screen and an LCD screen; the main cabinet is provided with a hollow area with a touch screen style and size, and the touch screen is placed in the hollow area. And after the cracks between the edge of the touch screen and the hollow area are pasted with waterproof soft and airtight silicone strips, the top appearance of the main cabinet is completely sealed, and the LCD screen is carefully fitted to the bottom appearance of the touch screen; the main cabinet and the heat dissipation rear cover remain unchanged Continuous, and the second waterproof soft airtight silicone strip is attached to the crack between the two to form a completely sealed cavity; the cavity is built with a heat dissipation plate and electronic components, and the heat dissipation plate is not fixed on the heat dissipation back cover. The inner end surface and the electronic components are arranged on the heat dissipation plate; the heat generated during the operation of the electronic components is conducted through the heat dissipation plate to the heat dissipation back cover, and then the heat is released into the atmosphere by the heat dissipation back cover.